The 15th IEEE International Conference on Embedded Software and Systems

Las Vegas Convention Center, Nevada, United States, June 2-3, 2019

Co-located with DAC 2019 (participants can access DAC Keynotes, Exhibits and Receptions)


IEEE ICESS 2019 is pleased to announce a truly international Technical Program Committee (TPC), comprised of domain experts from across the world. Each member of the TPC reviews paper submissions to ensure the continued high standard of ICESS. More TPC members will be added later.

Advanced Computing and Microelectronics Unit,India
Research Scientist, Intel Labs, Intel Corporation
New York University, USA
TelecomParisTech, France
Virginia Tech, USA
TU Dortmund University, Germany
NXP Semiconductors, USA
Robert Bosch GmbH, Germany
UC Merced, USA
Linköping University, Sweden
The University of British Columbia, Canada
University of York, UK
Nanyang Technological University, Singapore
University of Central Florida, USA
University of York, UK
University of Connecticut, USA
Computer Science and Information Engineering, National Chung Cheng University
University of Pittsburgh, USA
Illinois Institute of Technology, USA
Villanova University, USA
University of Electronic Science and Technology of China, China
Syracuse University, USA
University of Maryland, USA
Stockton University, USA
Chongqing University, China
Duke University, USA
Technische Universität Hamburg-Harburg, Germany
Wayne State University, USA
TUMCREATE Singapore, Singapore
East China Normal University, China
Advanced Digital Sciences Center, Illinois at Singapore, Singapore
Southern Connecticut State University, USA
Hunan University, China
The Chinese University of Hong Kong, China
Fudan University, China
Strategic CAD Labs, Intel Labs, USA
The Chinese University of Hong Kong, China
Rutgers University, USA
Nanjing University of Science and Technology, China
University of Science and Technology of China, China
University of South Florida, USA