IEEE ICESS 2019

The 15th IEEE International Conference on Embedded Software and Systems

Welcome To IEEE ICESS 2019

 

The advancement of embedded software and systems, such as intelligent vehicles, industrial robots, wearable devices, and Internet-of-Things, has great societal and economic impacts. It is of utmost importance to ensure the safety, efficiency, and security of their design and implementation. The IEEE International Conference on Embedded Software and Systems (ICESS) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in embedded software and systems. The conference has a broad scope covering the design, implementation, optimization, and validation of embedded software and systems in various domains, with recent focus on cyber-physical systems, Internet-of-Things, embedded security, and autonomous software systems..

The ICESS 2019 is the 15th IEEE International Conference on Embedded Software and Systems. It is the next event of a series of highly successful international conferences on embedded software and systems, held in recent years as ICESS 2017(Sydney, Australia), ICESS 2016 (Sichuan, China), ICESS 2015(New York, USA), ICESS 2014 (Paris, France), ICESS 2013 (Sydney, Australia), ICESS 2012 (Liverpool, UK), ICESS 2011 (Changsha, China), ICESS 2010 (Bradford, UK), and ICESS 2009 (Hangzhou, China).

Accepted papers from the conference will be published by the IEEE Computer Society in the IEEE Proceedings. Selected papers, after further revisions, will be considered for publication in the Elsevier Journal of Software Architecture.

The ICESS 2019 will be sponsored by the IEEE, the IEEE Computer Society, the IEEE Technical Committee on Scalable Computing (TCSC), and the IEEE Technical Committee on Real-Time Systems (TCRTS). The conference is also discussing with the IEEE Technical Committee on Cyber-Physical Systems (TCCPS) about sponsorship.

Keynote Speakers

TBA.

Acknowledgements

We acknowledge support from the following.