Welcome To IEEE ICESS 19


The advancement of embedded software and systems, such as intelligent vehicles, industrial robots, wearable devices, and Internet-of-Things, has great societal and economic impacts. It is of utmost importance to ensure the safety, efficiency, and security of their design and implementation. The IEEE International Conference on Embedded Software and Systems (ICESS) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in embedded software and systems. The conference has a broad scope covering the design, implementation, optimization, and validation of embedded software and systems in various domains, with recent focus on cyber-physical systems, Internet-of-Things, embedded security, and autonomous software systems.

The ICESS 2019 is the 15th IEEE International Conference on Embedded Software and Systems. It is the next event of a series of highly successful international conferences on embedded software and systems, held in recent years as ICESS 2017 (Sydney, Australia), ICESS 2016 (Sichuan, China), ICESS 2015 (New York, USA), ICESS 2014 (Paris, France), ICESS 2013 (Sydney, Australia), ICESS 2012 (Liverpool, UK), ICESS 2011 (Changsha, China), ICESS 2010 (Bradford, UK), and ICESS 2009 (Hangzhou, China).

Accepted papers from the conference will be published by the IEEE Computer Society in the IEEE Proceedings. Selected papers, after further revisions, will be considered for publication in the Elsevier Journal of Software Architecture.

The ICESS 2019 will be sponsored by the IEEE, the IEEE Computer Society, the IEEE Technical Committee on Scalable Computing (TCSC), and the IEEE Technical Committee on Real-Time Systems (TCRTS). The conference is also discussing with the IEEE Technical Committee on Cyber-Physical Systems (TCCPS) about sponsorship.

Scope and Topics


IEEE ICESS is an international forum for researchers and developers from academia, industry and government to present and discuss the science, engineering, technology and emerging ideas and trends of embedded software and systems. Topics of interest include, but are not limited to:

Systems, Models and Algorithms Track

  • Embedded System Architecture
  • Embedded Software Architectures
  • Embedded OS, Scheduling and Runtime Support
  • Embedded Storage and I/O Systems
  • Real-Time Embedded Systems
  • Distributed and Networked Embedded Systems
  • Fault Tolerant and Trusted Embedded Systems
  • Mixed-Criticality Embedded Systems
  • Heterogeneous SoC and Multicore Embedded Systems
  • Power and Thermal Aware Computing
  • Pervasive/Ubiquitous Computing
  • Reconfigurable Embedded Computing

Design Methodology and Tools Track

  • Design Technologies of Embedded Systems
  • Formal Methods for Embedded Systems
  • Middleware for Embedded Systems
  • IDE and Software Tools
  • Hardware/Software Co-Design
  • Component-Based Embedded Software Design
  • Model-based Design for Embedded Software
  • Domain/Application-Specific Design Techniques
  • Testing Techniques for Embedded Software/Systems
  • Verification and Validation for Embedded Systems
  • Compilation and Debug Techniques and Tools
  • Performance Evaluation Techniques and Tools

Emerging Embedded Applications and Interdisciplinary Topics Track

  • Intelligent Embedded Systems
  • Internet-of-Things (IoT)
  • Wearable Devices
  • Smart City
  • Robotics and Control Systems
  • Wireless Sensor Networks (WSN)
  • Cyber-Physical Systems (CPS)
  • Embedded Automotive, Medical and Avionics Systems
  • Embedded Database & Multimedia Systems
  • QoS Support for Embedded Systems
  • Embedded Network Protocol and Security
  • Emergency and Disaster Management
  • Consumer Electronics
  • Mobile Cloud Computing
  • Industrial Practices and Case Studies

Organizing Committee


General Co-Chairs

  • Naijun Zhan, Chinese Academy of Sciences, China
  • Qi Zhu, Northwestern University, USA

Technical Program Co-Chairs

  • Arvind Easwaran, Nanyang Technological University, Singapore
  • Sandip Ray, University of Florida, USA

Publicity Co-Chairs

  • Mingsong Chen, East China Normal University, China
  • Shangping Ren, San Diego State University, USA

Publication Chair

  • Yier Jin, University of Florida, USA

Finance Chair

  • Dakai Zhu, University of Texas at San Antonio, USA

Web Chair

  • Bai Xue, Chinese Academy of Sciences, China